| Method |
Laser
thin-film elimination method |
| Available
material |
Polyphthalamide
(PPA) / Ceramic (alumina) |
| Pattern
width (lines/space) |
Min.
70µm / 70µm |
Minimum
through-hole diameter
(double-sided boards) |
0.3
mm dia. (aspect ratio, 2 or less
<aspect ratio = board thickness / hole diameter>) |
| Maximum
pattern slope |
90° |
| 3-dimensional
level differences |
Possible |
| Wire
bonding |
Possible
(little roughness, good flatness) |
| Minimum
molding thickness |
Min.
0.4 mm (some parts 0.2 mm) |
| Number
of molding die required |
1
(when only a substrate) |
| Pattern
changes |
Possible
by changing laser patterning data
(however, through-hole changes require a molding die change) |
| Plating
specifications |
Cu
+ Ni + Au (Total: 10 to 50 µm) (Example) |
| Maximum
size (Panel size) |
30
x 65 x 10 mm |
| Soldering |
Reflow
soldering; peak 230°C±10°C
10 seconds or less (example) |
| Positioning
accuracy of molded part and circuit |
±
0.05 mm (max) |
| Dicing
accuracy |
±
0.10 mm (max) |
