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| [1] Is lead-free solder
supported? |
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| We recommend a low-temperature
type, such as the Sn, AG, or Cu type, that allows a reflow peak
temperature of 260¡C and 5 seconds. |
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| [2] Can you describe to
me an example of actual mass production? |
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| The first example of mass
production was of the NaPiOn human detection sensor. The next
was of a camera module substrate. From here on we can expect
to see application in the production of light-related products
such as IrDAs. |
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| [3] Is the plating electroless? |
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| No, the copper, nickel and
gold are all electrolytic plated. |
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| [4] Is a multi-layer coustruction
possible? |
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| Now only both sides. We have
just started development of multi-layering. |
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| [5] What type of IC mounting
is supported? |
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| Wire bonding and flip-chip
mounting have been shown successful. |
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| [6] Is a die always required?
Can a pattern be formed onto a cut model or structural model? |
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| A die is required. It may
not always be possible for the laser to draw patterns onto a
cut piece, etc., that has a rough surface. |
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| [7] Can resins other than
PPA supported? |
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| Although currently only PPA
and ceramic (alumina) is supported for mass production PPS,
PEEK and LCP can also be supported depending on the product
specifications. |
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| [8] What is the advantage
of material compared to resin and ceramic substrates? |
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| Regarding the linear expansion
coefficient, heat dissipation, and high frequency characteristics,
ceramic is superior. |
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| [9] What is the advantage
of MIPTEC compared to standard PCBs? |
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| Not being a board that uses
copper lamination, with MIPTEC, a formed working part is used
as the substrate material. |
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| [10] Can circuits be formed
on a perpendicular surface? What is the maximum angle of gradient
for patterns? |
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| Basically, a circuit can be
formed on any surface that can be irradiated by the laser. However,
on surfaces that incline 60 degrees or more, a joint might appear
in a part of the pattern. |
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| [11] What material is used
for the substrate resin? |
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| [12] Why is laser used
in pattern forming? |
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| It is used in order to form
the extremely minute circuits required for the mounting of semiconductor
chips. |
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| [13] How much is the adhesion
strength? |
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| The peel strength when the
pattern is peeled is 0.39 N/mm or greater (initial value). |
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| [14] Is reflow solder supported? |
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| Yes. However, the reflow conditions
are 260¡ C and 5 seconds maximum. |
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| [15] What is the dicing
method? |
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| Dicing can be done by dicing
saw or metal saw, etc. |
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| [16] What development steps
do you recommend? |
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| First, the shape and pattern
diagrams, or data, is presented by the customer. Based on that,
we have a meeting about specifications. After that, specifications
are fixed (spec sheets exchanged), the die is ordered, and a
test piece produced. |
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| [17] Are through-holes
possible? If so, what is the minimum hole diameter? |
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| Yes, possible. The minimum
hole diameter is Ø0.3
mm and the aspect ratio is 2 or less. |
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| [18] What are the Feature
of MIPTEC? |
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| Fine patterns and chip-on
MID (wire bonding and flip-chip mounting) are possible. |
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| [19] What is the minimum
molding thickness? |
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| In general it is 0.4 mm. In
parts it is possible to go down to 0.25 mm. |
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| [20] What is the pattern
positioning accuracy? |
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| The positional deviation of
the circuit pattern with the formed part is ±50 µm, although
this can be ±20 µm when specially ordered. |
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| [21] What is the coefficient
of thermal expansion for PPA? |
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| Although it differs depending
on the direction of resin flow when forming, it is approximately
15 to 20ppm. |
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| [22] Please tell me about
MIPTEC. |
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| MIPTEC stands for Microscopic
Integrated Processing Technology and is the MID (Molded Interconnect
Devices) technology proposed by Matsushita Electric Works. It
is a technology for manufacturing parts on substrates that contain
circuits, and mechanical and electronic functions. By using
lasers in the process, we are able to form microscopic circuits,
and the degree of freedom in changing patterns is very high.
This offers many advantages. |
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| [23] How many µm is the
pattern line width space width? |
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| Basically, it is 70 µm /70
µm, but it is possible to form even finer circuits. |
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| [24] Can the plating thickness
be changed? |
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| Yes, it can. Thickness can
be changed freely according to customer requirement. |
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