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MIPTEC, Matsushita Electric
Works' MID (Molded Interconnect Device) technology, allows
microscopic, three-dimensional circuits on the surfaces
of boards formed by injection molding.
Our many years of experience in resin molding technology
and circuit formation technology, together with the use
of the laser method on the patterning line, make possible
the formation of extremely minute, 3-dimensional circuitry.
This circuitry features increased freedom to make circuit
changes by changing the laser patterning data.
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| The development of
Highly Adhesive
Thin Film Technology for molded products, together
with plating technology that produces a high degree
of flatness, has enabled us to achieve excellent
wire bonding to support problem-free, high-density
molding |
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Ceramic MIPTEC
Electric circuits are formed directly on a ceramic (alumina) surface. It is used in such things as high sensitivity LED packages because of its excellent light extraction efficiency and heat dissipation.
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What is PIMITES?
PIMITES is the name given to micro-devices that apply MEMS, MID (MIPTIC), and n (nano) technologies.
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