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| Merits
of laser patterning |
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The development of Laser Patterning
Technology has enabled us to achieve a
fine pitch of 70µm/ 70µm (lines/space).
Furthermore, the use of the laser method greater freedom designing.
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| Realization of high-adhesion, thin-film technology |
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| The development of Highly
Adhesive Thin Film Technology for molded products, together
with plating technology that produces a high degree of flatness, has
enabled us to achieve excellent wire bonding to support problem-free,
high-density molding. |
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Resin surface with MEW method
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Resin surface that was alkali etched
(previous method)
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